(2019) Published in Advanced Functional Materials
- Joonsoo Jeong
- 2021년 10월 27일
- 1분 분량
A journal article entitled "Conformal Hermetic Sealing of Wireless Microelectronic Implantable Chiplets by Multilayered Atomic Layer Deposition (ALD)" has been published in ADVANCED FUNCTIONAL MATERIALS (Impact Factor: 13.3)
![Published in npj Flexible Electronics [JCR 1.8%, IF 12.3]](https://static.wixstatic.com/media/e1f057_9ed500ae2cab4c5a9164c8d91ae45c44~mv2.png/v1/fill/w_604,h_441,al_c,q_85,enc_avif,quality_auto/e1f057_9ed500ae2cab4c5a9164c8d91ae45c44~mv2.png)
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